Press Release (ePRNews.com) - NIEDERWANGEN, Switzerland - May 31, 2016 - GlencaTec’s glass encapsulation technology provides the key to Synoste’s novel limb lengthening system, Nitinail. The Nitinail uses bio-compatible shape memory alloys which allow for control of the lengthening process via an implanted glass encapsulated electronic capsule which can heat and cool the implant precisely with a revolutionary RF induced thermal elongation principle. Benefits of the Nitinail include normal mobility immediately following surgery, post-operative communication and most importantly controlled lengthening.
Glass encapsulation is a proven technology providing a complete hermetic seal for electronic implants. Glass also provides radio frequency transparency which is essential to the Nitinail’s elongation process and communications. When developing implanted electronics size, hermeticity, power, electronic autonomy or a communication function must all be addressed. Glass encapsulation allows for improved communication allowing for an external power source which in this case was inductive resulting in an implant small enough to fit inside the nail.
“The partnership between GlencaTec and Synoste provided the perfect solution of hermeticity and RF communication which was essential to the function of the revolutionary Nitinail” states Beat Scheidegger, GlencaTec’s Managing Director, “From the start this has been an exciting opportunity and we look forward to continuing to provide Synoste with the solutions they need in the long term.”
To get a copy of the Case Study, http://www.glencatec.com/category/news/
or contact Beat Scheidegger, firstname.lastname@example.org.
Located in Niederwangen, outside of Bern Switzerland, GlencaTec specializes in room temperature laser micro welding for advanced hermetic glass encapsulation. The company’s microfabrication solutions improve manufacturing processes but also revolutionizes microscale sealing of different materials. Hermetic glass encapsulation provide important benefits to the developers of smart implantable active medical devices, optical sensors and devices like micro-optics and MEMS component packaging. Source :